Advanced Nanosystems and Microelectronics

The particular strength lies in the development of smart integrated systems for different applications. With our partner Fraunhofer ENAS, we develop single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes.

Beyond CMOS and RF devices

  • Development of memristive devices and circuits for neuromorphic and in-memory computing
  • Devices and circuits based on Carbon Nanotubes/CNT-FETs  with focus on analog high frequency and hardware security applications

Packaging and Heterogeneous Integration

  • Focuses on the development of processes for the integration of electronic devices for wafer level packagin
  • especially joining and contacting processes, thin film encapsulation and screen printing for metallization and solder.

Design, Modelling, Simulation and Testing

  • Knowledge enhanced process models using AI for semiconductor processes and metrology.
  • Physical models for design of beyond CMOS devices.

Applications along the Value Chain

  • Medical Technology, Transport, and Industrial Automation
  • Internet of Things (IoT) and Wearable Devices, Cogntitive Internet Technologies
  • Communication and Information Technology

Research and Competence Areas

The particular strength lies in the development of smart integrated systems for different applications. With our partner Fraunhofer ENAS, we develop single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes.

Beyond CMOS and RF devices, integrated circuits and technologies

At Fraunhofer, we excel in the development of cutting-edge technologies and devices that go beyond traditional CMOS and RF devices. Our competencies lie in the advancement of memristive devices and circuits, particularly for applications in neuromorphic and in-memory computing. Through extensive research and innovation, we are actively contributing to the realization of efficient and powerful computing systems that mimic the human brain's neural networks. Additionally, we specialize in the development of technology, devices, and circuits based on Carbon Nanotubes (CNT-FETs). Our focus in this domain revolves around analog high-frequency applications and hardware security. By harnessing the unique properties of Carbon Nanotubes, we strive to create advanced solutions that address the ever-evolving demands of the modern technological landscape.

Packaging and (heterogeneous) integration (2D, 2.5D, 3D) for electronic devices. 

We are at the forefront of packaging and heterogeneous integration research. Our expertise lies in the development of processes that enable seamless integration of electronic devices, particularly focusing on wafer-level packaging. We specialize in various aspects of the integration process, including joining and contacting processes, thin film encapsulation, and screen printing for metallization and soldering. By pushing the boundaries of packaging technologies, we enable the realization of advanced electronic devices that are compact, reliable, and highly efficient. Our commitment to innovation and collaboration ensures that we remain at the forefront of packaging and integration advancements, supporting the needs of diverse industries.

Process and device modelling and simulation 

We specialize in the development of knowledge-enhanced process models that utilize artificial intelligence and physical methodologies. Our expertise covers a wide range of semiconductor processes and metrology, both in the front-end and back-end stages. By leveraging advanced modeling and simulation techniques, we provide invaluable insights into process optimization, performance prediction, and yield enhancement. Additionally, our research focuses on the development of physical models for the design of beyond CMOS devices. Through the integration of innovative modeling approaches, we enable the design and realization of novel semiconductor devices that push the boundaries of conventional technologies.

Systems and Applications

We consistently follow the value creation in the research and development process and is therefore a systematic consequence of the strategic orientation. We approach the multifaceted issues of our public and industrial partners by stringently extracting the possible, meaningful and sustainable applications from the problem space and transferring them to the solution space by means of the expertise and technology available at the institute in all business areas.

In this way, it is our essential task to generate projects together with our partners - on the basis of usable applications - which support and advance the mature development of laboratory demonstrators via functional models right through to the production process of our industrial customers.

Conversely, we also provide the groundbreaking impulses for the fundamental technology developments by deriving relevant research needs of the future from the emerging applications in the industrial and public environment.

Our Research Highlights

R&D for a Trusted Hardware Supply Chain

R&D to ensure integrity and trustworthiness of hardware components, employing rigorous testing and evaluation capabilities to identify vulnerabilities and protect against functional flaws and malicious activities.

Beyond CMOS: Nanomaterial-based FETs, high frequency CNT

R&D focus on industry compatible nanodevice technologies and the application of carbon-based nanomaterials in electronics and sensors. Development of wafer-level tools for nanomaterial processing, control over material properties and assembly, process qualification and heterogeneous technologies for integration of new functions in ASIC, MEMS or System-on-a-Chip concepts.

 

Collaboration with Fraunhofer ENAS and TU Chemnitz Center for Microtechnologies

 

Fraunhofer Singapore

Learn more about Fraunhofer Activities in Singapore

 

Fraunhofer Gesellschaft

Learn more about Fraunhofer Portfolio on Microelectronics in Germany

 

Fraunhofer Institute ENAS

Fraunhofer ENAS joins as new strategic partner institute

Prof. Harald Kuhn (Fraunhofer ENAS, TU Chemnitz) and his team joins the alliance in Singapore with a focus on Advanced Nanosystems and Microelectronics.

 

Forschungsfabrik Mikroelektronik Deutschland

Research Fab Germany

Fraunhofer ENAS is partner in the German-wide "Forschungsfabrik Mikroelektronik  Deutschland (FMD)" and its newly launched FMD-QNC for quantum and neuromorphic computing. 13 institutes from the two research organizations, Fraunhofer and Leibniz, are combining their expertise under one virtual umbrella, thus creating a new quality to the research and development of micro- and nanosystems.